The development trend of Pogo Pin technology
What is the development trend of Pogo Pin technology? Traditional connector design is limited by physical space, and the terminal will fail due to mechanical stress, repeated insertion and removal, and current overload. Connectors are components of many different plastic parts and metal parts. In addition to industry standards, it is not restricted by size and shape. The following technologies replace or enhance the function of the connector: solder ball connection, hard wiring, cable assembly, IC serialization, and signal debugging.
The application of connectors will also shift to higher-level packagings, such as switching from chip packaging to motherboard packaging to meet the packaging requirements of a single IC three-dimensional system. These factors will have a revolutionary impact on the development of the connector industry. With the development of higher-density chips, the cooperation of system packaging, and connector selection; the size and shape of the connector jump to the next stage.
Key points:
Semiconductor technology continues to expand or eliminate the application field of connectors.
The connector performance affected by semiconductor technology includes transmission speed, terminal density, heat dissipation performance, and wireless requirements...
The connector industry has become more compliant with environmental standards (such as RoHS/WEEE).
Technology trends include smaller connector terminal sizes and connector signal integrity at higher frequencies.
Further development of materials and process technology.
The emergence of nanotechnology has brought breakthroughs in material technology.
If PCB and electronic packaging enter the "micron" field, connector terminals will enter the 0.1mm era, and there will be new breakthroughs in connector fine processing equipment and technology.