The Dip Spring-loaded Pogo Pin
Dual-in-line package pogo pins (English: dual in-line package), also known as DIP package or DIP package, abbreviated as DIP or DIL, is a packaging method for integrated circuits. The shape of the integrated circuit is a rectangle. There are two parallel rows of metal pins on the side, called pogo pin headers. DIP-packaged components can be soldered into plated through-holes on the printed circuit board, or inserted into DIP sockets.

The Dip Spring-loaded Pogo Pin
The DIP pogo pin packaged CPU chip has two rows of pins that need to be inserted into the chip socket with a DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering. DIP-packaged chips should be plugged and unplugged from the chip socket with special care to avoid damage to the pins. DIP package structure forms are multi-layer ceramic DIP DIP, single-layer ceramic DIP DIP, lead frame DIP (including glass-ceramic sealing type, plastic packaging structure type, ceramic low melting glass packaging type) Wait.

The Dip Spring-loaded Pogo Pin
The commonly used DIP package conforms to the JEDEC standard, and the pitch (pitch) between the two pins is 0.1 inches (2.54 mm). The distance between the two rows of pins (row spacing, row spacing) depends on the number of pins, the most common is 0.3 inches (7.62 mm) or 0.6 inches (15.24 mm). Other less common distances are 0.4" (10.16mm) or 0.9" (22.86mm), and some packages have 0.07" (1.778mm) pitch and 0.3", 0.6" or 0.75" line spacing.

The DIP-pogo pin packages used in the former Soviet Union and Eastern European countries are roughly close to the JEDEC standard, but use the metric 2.5 mm pitch instead of the imperial 0.1 inches (2.54 mm).

The number of pins in the DIP package is always an even number. With 0.3" line spacing, 8 to 24 pin counts are joint, and packages with 4 or 28 pins are occasionally seen. Joint pin counts are 24, 28, 32, or 40 if the row spacing is 0.6 inches, and packages with 36, 48, or 52 pins are also available. CPUs such as the Motorola 68000 and Zilog Z180 have a pin count of 64, which is the maximum pin count for a commonly used DIP package.