Reflow Soldering and Wave Soldering in Pogo Pin Project
In general, Pogo Pin connectors use two soldering methods: reflow soldering and wave soldering.
Reflow soldering refers to brushing a solder paste on the surface of the pads (contact pads) of the PCB board. After connecting one or more electronic components, soldering is performed by heating in a multi-temperature reflow oven to achieve permanent curing bonding.
Today's digital electronic products are developing in the direction of ultra-small, ultra-fine, and ultra-thin. The internal structure design space is becoming more and more compact, the PCB board design layout is becoming more and more compact, the terminal products are updated faster and faster, and the sales volume is increasing. It is getting higher and higher, and wave soldering and hand soldering have been unable to meet its development. Only by using reflow soldering technology can high-precision, high-efficiency, and high-quality SMT patch production be carried out. Pogo Pin connectors are widely used in consumer electronic mobile terminals and industrial electronic products due to their small size, high life, large current, beautiful appearance, and convenient structural design for design engineers.
Pogo Pin connectors are available in two ways:
The first is the flat-bottom patch type, which is mounted on the surface of the PCB pad. We call it SMT surface mount technology, as shown below:
The second is the pin with the tail pin inserted into the PCB board hole patch welding, we call it plug-in SMT patch welding, which is also a type of reflow soldering. The purpose of using this method is to improve the gripping force of the components. It is more firmly bonded to the PCB board. As shown below:
2. Wave soldering
Wave soldering is a process of soldering components with molten solder forming solder wave crests. This method of soldering requires first inserting the pins of components into the holes of the PCB. Wave soldering is suitable for heavy-duty plug-in pin electronic components, but not for self-weight electronic components. Very light and pinless soldering of SMD electronic components.
