The pogo pin material is mainly made of copper, and its surface is required to be treated to make it more resistant to corrosion and friction. Typical surface treatments are nickel plating followed by gold plating and copper plating followed by tin plating. Next, follow Wanchang to briefly understand and analyze the surface treatment process of connectors such as the electroplating process, equipment, products to be plated, and electroplating layers.
The pogo pin electroplating process is basically the same as the general electroplating process, but the working time of each process is obviously shorter than that of general electroplating. Therefore, each treatment solution and the plating solution must be adjusted accordingly to meet the requirements of short operating time. Let's learn about the gold plating process of pogo pin with Wanchang's editor.
First, degreasing: Different from the general electroplating process, the degreasing time of the pogo pin is about 2 to 5 seconds, so it is necessary to use multi-stage electrolytic degreasing under high current density.
Second, pickling: Due to the size requirements of the metal to be plated, chemical grinding or electrochemical grinding is generally used for pogo pins, and metal self-dissolution is seldom or basically not used.
Third, nickel plating: Pogo pins generally use a sulfamate plating solution. The purpose of nickel plating is to provide an undercoating layer for gold plating and tin plating to improve corrosion resistance and at the same time prevent the degradation of the performance of the electroplating layer caused by the interdiffusion of the substrate (mostly copper alloy) and the gold layer, or the lead layer.