Common quality problems of Pogo pin
Power failure: The product structure uses the above-mentioned B scheme, the impedance is too large, the material accuracy is not high, the assembly process is poor, and the electroplating process is not good;
Card PIN: The accuracy of the material is not high (processed by the cutting machine), and the assembly process is poor;
Return PIN: Plastic tolerance is too large;
PIN removal: The material accuracy is not high, and the processing technology is not good (processed by the cutting machine);
Plastic cracking and blistering: plastic tolerance is too small, material
Poor soldering: The flatness of the product is not good, and the electroplating process is not good.