Spring Probes Pogo Pins

Spring Probes Pogo Pins

Spring probes are also known as pogo pins. They are spring-loaded contacts that are used for testing printed circuit boards (PCBs) and other electronic components. These high-quality, precision-made pins are available in a variety of lengths, diameters, and plunger types to accommodate your needs.

What is the use of spring probes?

Spring probes are used in the testing of electronic components.In Test & Measurement applications, they are used to contact test points, connecting the DUT (device under test) with the test equipment. Spring probes are also used to perform functional tests (FCT) on the DUT to test its performance under conditions that simulate or are almost equal to the working conditions in which the equipment will be used.

What is the use of pogo pins?

Pogo pins are a type of contact used in electronic devices to make connections. They offer a stable and secure connection for transferring data, power, or signals between two devices. Pogo pins are used for their improved durability over other electrical contacts, and the resilience of their electrical connection to mechanical shock and vibration.

What is the difference between spring probes and pogo pins?

Spring probes and pogo pins are both types of electrical connectors used in electronic devices to make connections. Spring probes are spring-loaded contacts that are used for testing printed circuit boards (PCBs) and other electronic components. Pogo pins are also a type of contact used in electronic devices to make connections. They offer a stable and secure connection for transferring data, power, or signals between two devices.

Probe test Probe: designed to ensure quality and reliability, and reduce development time and device manufacturing process costs.

Spring Probes Pogo Pins

Suitable for: Wafer, IC testing, IC design, etc.

The inspection content includes:

1. Signal leads to tiny connection points

2. Failure analysis failure confirmation

3. Confirmation of electrical characteristics after FIB circuit modification

4. Wafer reliability verification

The high degree of automation, breaking through the limitation that the production cost is proportional to the number of pin counts, which is conducive to the production of high pin count probe cards, which is suitable for high pin count (~30k pins/card), high current and high probe compression stroke testing.

In order to improve the quality, we have also prepared high-quality heat treatment, electroplating, and assembly production lines by ourselves, and have the German Fisher "X-RAY" thickness gauge, Japanese hardness tester, projector, and other testing equipment. The high-end products use American beryllium. High-quality materials such as copper or Japanese SK4.

The probes we produce are widely used in ICT, ICT, PCB, FPC, and other equipment, as well as testing and other communication products in the fields of computers, telecommunications, automobiles, and the military.

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