Semiconductor Testing Pogo Pin

Semiconductor testing Pogo pin

After the semiconductor wafer has completed the manufacturing process, each chip needs to be functionally tested, and unqualified chips are marked to avoid packaging at the back end. This kind of test needs to transmit signals through a series of connections, from the chip through the probe card probe test connector and the circuit board to the automatic test machine, the pogo pin test connector (probe tower) is a vital part in the middle section, To ensure stable signal transmission to achieve accurate and stable chip test results. As chips become more sophisticated and have more and more functions, the requirements for testing are getting higher and higher. The existing pogo pin test connectors can no longer meet the test of chips with multiple functions and multiple outputs.

At the same time, the existing semiconductor test connectors only use no more than 3,000-pin Semiconductor testing Pogo pins, and the scope of application is subject to many restrictions.

The core technology of the Semiconductor spring test Pogo pin is the ability of fine processing and assembly, which involves fine processing equipment, experience, and process capability.

The spring in the test pogo pin is a key factor in the service life of the test probe. The electroplated spring has a long service life, will not rust, and can also improve the durability and conductivity of the test probe.

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