How to optimize the electrical performance of the female connector?
The optimization of the electrical performance of the female connector can be considered from the following aspects, that is, the control of the existing and upcoming films on the plated surface. One of the main requirements for the electrical performance of the busbar is to establish and maintain a stable busbar impedance. To achieve this, metal contact interfaces are required to provide this inherent stability. Establishing such a contact interface requires a thin surface that can swim or split when contact mating. These two different washing methods clearly show the difference between precious or rare metals and ordinary metals.
“To varying degrees, noble metal coatings such as gold, palladium, and their alloys do not essentially adhere to the surface film. For these coatings, metal contact at the interface is relatively straightforward, as it only requires movement of the partner Contact the surface during mating. Usually, this is easy to achieve. To maintain the stability of the contact interface impedance, the design of the bus bar requires attention to maintain the noble metal of the contact surface to prevent contaminants, base metal diffusion, contact wear, and other external factors Impact.
Ordinary metal coatings, especially tin or tin alloys, are naturally covered with an oxide film. The effect of the tin contact coating is that during the matching process, this oxide layer is easily destroyed, making it easy to create metal contacts. The requirements of busbar design are to ensure that the oxide film does not break when the busbar is matched and to ensure that the interface is no longer oxidized within the validity period of the electrical connector.
In wear corrosion, re-oxidation corrosion is the main performance degradation mechanism of tin contact coatings. Mother silver contact plating is considered a common metal plating because it is easily corroded by sulfides and chlorides. Nickel coatings are generally considered common metals due to the formation of valve passages.